F3.5 THT IC package naming conventions
The following footprint naming conventions should be used as examples for naming THT IC package footprints.
If you do not find an appropriate convention that matches a particular footprint type, either contact the KiCad library team or try to match a convention set by existing library components.
In the entries below, variable fields are denoted as follows:
- Fixed fields
- Mandatory fields
- Optional fields
Through Hole Packages (DIP)
- PKG - Package name
- Pincount - Number of (unique) pins
- X - Major dimension of part on x axis
- Y - Major dimension of part on y axis
- Z - Major dimension of part on z axis (Optional)
- Lead span - Distance between leads
- Pitch - Lead pitch
- Modifiers - Modifiers to footprint specifications
- Options - Extra footprint options (Optional)
Example:
Notes:
-
Drill size (if specified) must be given in
mm
Through Hole Packages (TO)
- PKG - Package name
- Pincount - Number of (unique) pins
- X - Major dimension of part on x axis (Optional)
- Y - Major dimension of part on y axis (Optional)
- Z - Major dimension of part on z axis (Optional)
- Lead span - Distance between leads (Optional)
- Pitch x - Lead pitch in x dimension (Optional)
- Pitch y - Lead pitch in y dimension (if different from x dimension) (Optional)
- Stagger - Pin staggering options (Optional)
- Modifiers - Modifiers to footprint specifications (Optional)
- Orientation - Component orientation (see notes below)
- Options - Extra footprint options (Optional)
Example:
Notes:
-
Drill size (if specified) must be given in
mm
-
Orientation
can be chosen from:-
Vertical
-
TabDown
-
TabUp
-
-
Stagger
can be chosen from:-
StaggerOdd (odd pins are further from component body)
-
StaggerEven (even pins are further from component body)
-
Size Parameter:
Orientation: