Library Conventions | KiCad EDA
Version 3.0.64
Library maintainer rules & guidelines
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S1 Symbol Libraries
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Generals
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G1 General Guidelines
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G1.1 Only standard characters are used for naming libraries and components
G1.2 Withdrawn
G1.3 Libraries are organized by functionality
G1.4 English language should be used throughout libraries
G1.5 Plural naming is to be avoided
G1.6 Capitalization conventions
G1.7 Library files use Unix style line endings
G1.8 Contributions to the official library must be made using the current stable version
G1.9 Dimensional units
G1.10 Embedding files
G1.11 Default font
G2 Generic and Fully Specified Symbols
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G2.1 Definition of terms: Generic and fully specified symbols
G3 Special Pin Numbering
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G3.1 Relays
G3.2 Audio Connectors
Symbols
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Footprints
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F1 Footprint Libraries
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F1.1 Footprint libraries are categorized by function
F1.2 Connector footprint libraries
F2 General Footprint Naming Guidelines
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F2.1 General footprint naming conventions
F2.2 Footprint naming field prefixes
F2.3 Manufacturer specific version of generic footprints
F2.4 Footprint naming for non-standard pin numbering
F2.5 Footprint naming conventions for specific components
F3 Specific Naming Conventions
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F3.1 SMD chip package naming conventions
F3.2 Resistor naming conventions
F3.3 Capacitor naming conventions
F3.4 SMD IC package naming conventions
F3.5 THT IC package naming conventions
F3.6 Connector naming conventions
F3.7 Fuse naming conventions
F4 General Footprint Requirements
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F4.1 Datasheet recommendations take priority
F4.2 Pin 1 should be located at the top left
F4.3 Connected copper elements have the same pad number
F4.4 Thermal pads
F4.5 Specifying footprint keepout areas
F4.6 Local clearance and settings should be set to zero
F5 Layer Requirements
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F5.1 Silkscreen layer requirements
F5.2 Fabrication layer requirements
F5.3 Courtyard layer requirements
F5.4 Elements on the graphic layer should not overlap
F6 Surface Mount Components
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F6.1 Footprint component type must be set to surface mount
F6.2 Footprint anchor should be placed in the middle of the component body
F6.3 Pad requirements for SMD footprints
F7 Through Hole Components
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F7.1 Footprint placement type must be set to Through Hole
F7.2 Footprint anchor should placed at the location of Pin-1
F7.3 Pin 1 should be rectangular or a rounded rectangle. Other pads circular or oval
F7.4 Pad requirements for THT footprints
F7.5 Minimum annular ring width
F7.6 THT hole diameter
F7.7 Oval holes (plated milled slots)
F8 Component types
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F8.1 Non SMD/THT components
F9 Footprint Properties
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F9.1 Footprint meta-data is filled in as appropriate
F9.2 Footprint properties are as default values unless otherwise required in datasheet
F9.3 Footprint 3D model requirements
Models
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M1 Contributing Models
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M1.1 The contributor must own the rights to share the 3D model
M1.2 Withdrawn
M1.3 Source files for 3D models must be supplied
M2 3D File Requirements
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M2.1 3D models must be supplied in STEP format
M2.2 Model alignment and scaling
M2.3 Freecad is the preferred design tool