KLCFootprints F3 Specific Naming Conventions Section F3 Specific Naming Conventions Guidelines in this section F3.1 SMD chip package naming conventions F3.2 Resistor naming conventions F3.3 Capacitor naming conventions F3.4 SMD IC package naming conventions F3.5 THT IC package naming conventions F3.6 Connector naming conventions F3.7 Fuse naming conventions Edit this page on GitLab PreviousF2.5 Footprint naming conventions for specific components NextF3.1 SMD chip package naming conventions