Library Conventions | KiCad EDA

Version 3.0.43

Library maintainer rules & guidelines

F7.6 THT hole diameter

  • Hole sizes refer to the finished hole size after plating (as opposed to the drill size before plating)

  • For soldered through-hole pads, minimum hole diameter is the maximum lead diameter plus 0.2mm

  • This is derived from IPC-2222 class 2 recommendations

  • Maximum lead diameter is obtained from the device datasheet, and includes tolerances.