Update G1.9 to explicitly specify coordinate order

Revise Pin1 Silkcreen Rule

Update S6.3 to mandate solid zone connections for heatsink pads

Update F7.6 to specify that the hole size is the finished hole size

Update S5.2 to mandate EP size in footprint filters if needed for disambiguation

Update F6.3 to specify pad properties for heatsink and BGA pads

Update F6.3: require rounded rectangles for SMD pads

Improve S4.2 Pin location rule: allow in-out-style voltage regulators

Add dash and underscore escape convention in filters (S5.2)

Improve hints for paste-only pads (F6.3)

Add new rule to disallow de-morgan style (S3.9)

Specify a tilde for the datasheet link of a generic symbol (S6.2)

Update S2.2 with guidelines on functional variant codes

Add rule G3.1 about relay pin numbering

Remove outdated kicad4 info from F6.1, describe the checkboxes

Update F8.1 rule to v6

Update S4.4 example picture

Update F6.1 example picture

Add AE for antennas to S6.1

Remove S1.1 text regarding .dcm and .lib files

Rework all references to the "alias" function of kicad5, replace with the new "derive" wording

Update S7.1 for power symbols

Update S7.2 for graphic symbols

Update F5.2 for reference designator

Update S4.7 Active low pins

Rework F4.5 rule for keepout areas

Update overbar syntax to use the new curly bracket syntax (S4.7)

Rework ruleset for 3d model contributions

Clarify restrictions for third party contributions (M1.1)

Remove rule M1.2 as it implied models provided by manufacturers are preferred

Clarify what counts as source files and add note about script contributions (M1.3)

Clarify that all contributions must be made with both wrl and step models (M2.1)

Clarify that Freecad is the preferred design tool (M2.3)

Change general guidelines (G) to mention templates and 3D models

Clarify that contributions must be made with the current stable version (G1.8)

Update section about symbol documentation to KiCad 5.1 GUI (combined S6.2 and S6.3)

Clarify rule for parts with toleranced dimensions

Fab comes from the nominal component dimensions (F5.2)

Courtyards, where based on component sizes (as opposed to where the courtyard comes from the pads), are referenced to the nominal body size. This is an IPC rule. (F5.3)

Clarify that the silk below tht exception is only for additional silk markings

Clearer screenshots for polarized and non polarized silk markings

Clarified KiCad footprint assignment workflows as generic vs fully specified symbols (G2.1)

Replace the word atomic with fully specified as this term better fits the used methodology (G2.1, S2.x)

Added a small definition where generic symbols are to be used (G2.1)

Specified when a separate symbol needs to be drawn vs when an alias is enough (S2.3)

Clarify rules regarding NC pins

Clarify handling of hidden pins

Update F9.1 screenshots and terms to match current GUI

Clarify symbol naming for symbols with multiple manufactureres with different package suffixes (S2.1)

Added more details on silk-to-pad clearance (F5.1)

Specified that thermal pads with vias need a bottom copper pad (F4.4)

Expanded details for selecting pin length (S4.1)

Minor edits for style, wording, and grammar

Document rules for overlapping/duplicate graphic elements (new rule F5.4)

Correct Pin length definition for staggered TO (image in F3.5)

Document rules for handling oval holes (new rule F7.7)

Document circular hole suffix (F2.1)

Document suffix for multi unit parts (S2.1)

Document clearance requirement between exposed pads and normal pads (F6.3)

Remove inverse 45-degree direction for connectors. (image in F3.6)

Clarify footprint filter rules. Especially regarding exposed pads. (S5.2)

Better wording for pin stack requirements (S4.3)

Include suggestion for exposed pad size in pad requirements rules (F6.3)

Fix TabUp suffix writing style (image in F3.5)

Correct pin layout field description for connectors with different pins per row (F3.6).

Clarify fab layer text sizes and placements to fit current library state (F5.2)

Clearer language for 3d model settings of footprints. (F9.3)

Clarify active low pins in symbols (S4.7).

Clarify footprint naming and pin numbers for parts with shield or mounting pins.

Allow the use of rounded rectangle pads for marking pin 1 in THT parts.

Remove mentions of ThermalPad(s) suffix from all rules. (The only thermals related suffix is ThermalVias)

Clarification of fontsize requirements for symbol fields (S3.2)

Specify solderpaste coverage for exposed pads

extended S5.2 to explain pin-count in FPFilters

Clarification/Correction of NC-pin rules

Clarification of courtyard clearance.

Fix examples in connector naming convention

Fix naming convention for tantal caps

Allow pin name offset values less than 20mils (must → should)

Require Layout field in BGA packages to have prefix

Body size must be first parameter for BGA packages

Added allowance for + character in filenames

Added allowance for , character in filenames

KLC moved from GitHub wiki to KiCad website

KLC rules organized into logical groups, rather than single sequential set of rule numbers

Complete reorganization of the rules as per the above change

Each KLC rule now has its own page, allowing for better descriptions

Most rules have been overhauled and significantly improved